Foxconn Interconnect Technology Limited Completes $342 Million Initial Public Offering and Listing on Hong Kong Stock Exchange

July 13, 2017

Foxconn Interconnect Technology Limited completed its initial public offering and listing on the Hong Kong Stock Exchange, raising gross proceeds of approximately $342 million (which could rise to $393 million if the overallotment option is exercised in full). Foxconn Interconnect Technology is a world-leading interconnect solutions provider, and is a member of Foxconn Group, one of the largest electronics contract manufacturers and a Fortune 500 company. Foxconn Interconnect Technology's major customers include leading high-tech companies.

The offering consists of a Rule 144A offering, a Regulation S offering, and a public offering and listing in Hong Kong. S&C advised the underwriters on both Hong Kong and U.S. law matters.

The S&C team was led by Kay Ian Ng and Garth Bray, along with Ching-Yang Lin, Vincent Lee and Carmen Leung. Jeffrey Hochberg, Slki Hong and Lauren Citrome advised on U.S. tax matters. Tracey Russell advised on blue sky matters. Pengwei Liu also provided valuable support.